Home > Products > Inspection Machine > SAM Auto Wafer 304

SAM Auto Wafer 304
Application

This line was specially developed for the inspection of wafers or bonded wafers (MEMS) to detect cavities, inclusions, or delamination in bonded layers.

Features

Loadport can be docked with standard Cassette

Aligner wafer calibration, edge detection

Dedicated wafer Robot for sampling, barcode reading, and sample placing in the sink

Four probes collaborate for rapid wafer ultrasound detection

Technical Parameter
Application
4” , 6”, 8”, 12”wafers
Dimension
2400x2000x1300㎜
Transducers
4 transducers, customizable
Resolution
1~4000 μm
Bandwidth
1-500 MHz
Scanning Settings
High precision scanning, fast scanning
Platform
Marble
X/Y axis
Linear motor, gantry double drive
Max Scanning Speed
2000mm/s
Max acceleration
2G/s
Frequency
Compatible with 1~300MHz
Fixture
Dedicated to wafer, customizable
Auto Loading and unloading
Customizable
Samples
Stock Name:

骄成超声

Stock Code:

688392



Sales hotline:400-888-0829
After-sales hotline:400-888-3348