IGBT module layered detection.

Semiconductor chip packaging layer detection.

Diamond thickness measurement and internal defect detection.

Detection of welding defect of water-cooled radiator plate.

Multiple scanning modes

Analysis of samples in the ultrasound frequency range up to 1GHz/s

Equipped with a graphical user interface for ease of operation and flexible applicability

Scanning range: 400㎜*320㎜*120㎜