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> SBT Showcases Semiconductor Ultrasonic Solutions at SEMICON SEA 2026
KUALA LUMPUR, Malaysia — May 7, 2026 — As SEMICON Southeast Asia 2026 enters its final day at MITEC, SBT Ultrasonic Technology CO., LTD (SBT, Stock Code:688392) continues to lead the conversation in the semiconductor equipment sector. Located at Booth 2152, SBT is showcasing its latest breakthroughs in ultrasonic bonding and non-destructive testing (NDT) designed for the evolving needs of the global semiconductor industry.
As a premier provider of ultrasonic solutions, SBT focuses on self-developed technologies that address critical challenges in semiconductor manufacturing. The spotlight of the exhibit is the SAM/SAT (Scanning Acoustic Microscopy / Tomography) product line, which is essential for quality control in advanced packaging, power semiconductors, and Micro LED sectors.
SBT’s semiconductor portfolio includes:
Wafer-Level SAM/SAT Systems for high-resolution internal defect detection.
Ultrasonic Wire Bonders (Aluminum/Copper) for reliable interconnects.
Ultrasonic Pin and Terminal Welders for IGBT power modules.
High-Precision SAM/SAT Solutions for Advanced Packaging
The SBT Wafer-Level SAM/SAT system (Wafer400 Series) has gained significant traction, with successful deliveries to top-tier semiconductor clients. This equipment is a cornerstone for ensuring the reliability of 2.5D/3D and panel-level packaging.
By utilizing intelligent algorithms, the SBT SAM/SAT systems accurately detect:
Voids and micro-bubbles in wafer bonding.
Delamination between material layers.
Cracks within the semiconductor substrate.
Featured Product Matrix:
Wafer400-F2 (D2W Fully Automatic In-line Model): Specially designed for 2.5D D2W bonding, compatible with W2W bonding process ultrasonic inspection; dual-station configuration supports wafer flip inspection.
Wafer400-A4 (W2W Fully Automatic In-line Model): Tailored for Wafer-to-Wafer (W2W) bonding process with optional multi-probe configuration.
Wafer400 (Wafer-level Offline Model): Compatible with both W2W and D2W processes, meeting Class 100 cleanroom standards.
US300 Series (Standard Offline Model): Universal standard model optimized for laboratory use, compliant with Class 1000 cleanroom requirements.
SEMICON SEA is a vital platform for SBT’s global expansion. Our team at Booth 2152 is engaged in deep technical discussions with global partners to foster the next generation of semiconductor manufacturing.
Today is the final day of SEMICON SEA 2026. SBT cordially invites industry professionals to visit our booth and discover how our ultrasonic and SAM/SAT technologies are defining the future of the semiconductor supply chain.
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